Web参考标准 ReferenceCriterion 测试条件 TestCondition 时间 Time 数量 Quantity 接受/拒收 Ac/Re 回流焊 Resistanceto SolderingHeat JESD22-B106 Temp:245℃max T=10sec 3times 22Pcs 0/1 温度循环 thermocycling JESD22-A104 120℃±5℃30min.-40℃±5℃30min. 100Cycles 22Pcs 0/1 高温保存 HighTemperature storage WebJESD22-A104F. This standard provides a method for determining solid state devices capability to withstand extreme temperature cycling. This standard applies to single-, dual- and triple-chamber temperature cycling and covers component and solder interconnection testing. It should be noted that this standard does not cover or apply to thermal ...
JEDEC JESD22-A104E-2014 标准 - antpedia.com
Web冰豆网(bdocx.com)是在线下载分享平台,提供PPT模板和Word文档下载。你可以上传学术论文,研究报告,行业标准,课后答案,教学课件,工作总结,作文等电子文档,分享知识获取收益,还可以分享最新的行业资讯。 WebJEDEC-22A-104F-2024温度循环试验条件与銲点导通试验要点:. 驻留温度: Ts (max)的+5℃~-10℃、Ts (min)的-5℃~+10℃. 驻留段总时间: Ts (max)的-5℃~+10℃、Ts … saga curse of the shadow
芯片可靠性测试要求及标准解析 - 百度文库
WebJESD22-A104-C. This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high and low … WebJESD22-A104 Datasheet, PDF : Search Partnumber : Match&Start with "JESD22-A104"-Total : 6 ( 1/1 Page) Manufacturer: Part No. Datasheet: Description: Broadcom … WebJEDEC可靠性测试标准最新更新目录. 电子器件产品可靠性测试是产品质量保证中的重要一环, 包含有Pre-con, aging (寿命)和ESD (静电)等, 下面就收集了权威标准JEDEC全系 … saga: curse of the shadow 2013